TS300

MPI TS300 engineering probe system is a cost effective yet highly accurate manual probe system designed for precision analysis of substrates and 300 mm wafers. The TS300 may be configured to support a wide variety of applications such as Wafer Level Reliability, Failure Analysis, IC Engineering, and MEMS. The compact and rigid platen design accommodates up to eight DC or four RF MicroPositioners for various application requirements. The highly repeatable platen lift design with three discrete positions for contact, separation, and loading with a safety lock utility allows for easy step and repeat functionality.